NDS
NDS Semiconductors / MEMS equipment including ultrasonic cleaning systems, spin cleaning machines, dicing saws and more.
Dicing
Heat-Resistant Dicing Tape (UV curable)
Heat-Resistant UV curable Dicing Tape with three kinds of Lineup.
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(De-)Taping, Mounting, Curing
NDS 312/308 (6" to 12") UV Curing System
Manual 6″ to 12″ Wafer Frame UV curing Machine
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(De-)Taping, Mounting, Curing
NDS 212/208 (6" to 12") Wafer Mounting Systems
6″ bis 12″ Manuel Wafer Mounter
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Wet Processing
YM-S1-M Wafer Spin Cleaning Machine
Manual Loading 3-12″ single wafer spin Cleaning machine
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Wet Processing
NDS 412/408/406 Spin Cleaner (4" to 12")
Manuel Loading Automatic 4″-12″ single wafer spin cleaning system
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Dicing
Dicing Blade (Resin, Electro-formed, metal or vitr...
Dicing Blade (Resin, Electro-formed, metal or vitrified)
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Grinding
Grinding Wheels for hard Materials
SiC and Sapphire Grinding Wheels: fine or coarse options available.
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