Chemical Concentration Meter
Testproduct LM
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INFOAxus Technology provides advanced CMP tools and technology, along with exceptional technical expertise for polishing, wafer cleaning, precision wafer grind processing, and legacy tools; making Axus Technology one of the best highly specialized technology suppliers and consulting services focused on engineering capability and efficiency in supporting the CMP market.
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Post CMP Scrubber with possible simultaneous scrubbing of 2 wafer sizes (up to 200mm), high Throughput.
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Mirra CMP Tool is a Dry In Dry Out (DIDO) CMP machine with three polishing plates...
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Dual Slurry / Cleaning Chemistry Delivery System.
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Mirra CMP Tool is a Dry In – Wet Out (DIWO) CMP machine with three polishing...
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Advanced Grinding process development up to standard production foundry.
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Advanced CMP process development up to standard production foundry.
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Automatic Cassette to cassette high Throughput two-spindle, three-chuck table 200mm Grinder.
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Cassette to cassette two-spindle, three-chuck table Grinder, enables ultra-thin grinding.
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Automatic Cassette to cassette high Throughput two-spindle, 2 Grinding Chucks 200mm Grinder.
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Manuel loading automated in-feed Grinder with 2 spindles for up 150mm wafers.
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Manual Loading Automatic grinder with high-rigidity, low-vibration spindle for superior grinding and low throughput.
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Double-sided PVA Scrubber for 100mm to 200mm wafers.
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Double-sided PVA Scrubber for 100mm to 200mm wafers.
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Double-sided PVA Scrubber for 100mm to 200mm wafers.
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Manuel loading, one spindle one carrier automated compact Dry In Wet Out (DIWO) CMP System.
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Dry In Wet Out (DIWO) automated 2 Platen one spindle CMP System.
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Carrier Upgrade with Axus advanced 4 zones Membrane Carrier for ultra thin or fragile Wafers.
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