STM1200X Semi-Automatic Wafer Mounter

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By TEIKOKU

Supplier Info

Product Type:

Equipment


Application:

(De-)Taping, Mounting, Curing


Product Description:

Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping.

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  • Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.

 


Product Enquiry Form

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  • This field is for validation purposes and should be left unchanged.