Product Type:
Equipment
Application:
CMP, Wet Processing
Product Description:
Post CMP Wafer Cleaner is Integrated with Two Double Brush Stations with Compact Design for Small Footprint and Versatility of Cleaning (8″~12″) Wafers.
Applicable wafer size : 200㎜(8”) and 300㎜(12”)
Configuration:
- Stand alone with 4 cleaning station
- Pre-cleaning with DIW knife
- Two double side roll brush cleaning
- Spin rinse dry with N2 blow (Option : Separated QDR)
- Cleaner size : 1,970W 975D 1,380H㎜
- Brush size : Ø70(OD) Ø32(ID) 320(L)㎜
Pre cleaning station:
- DIW spray cleaning & DIW curtain between stations
- Roller brush station
- Chemical : NH4OH(<1%) or DIW
- Brush type : Double side PVA brush
- Rotating speed : <±2% of full scale Range 30 ~ 300rpm
- Chemical supply : 4 Nozzle and through the brush
- Available chemical : 2 Chemical[NH4OH]
- Chemical flow rate : < 1L/min full scale
- DI flow rate : < 5L/min full scale
Spin station
- Spin speed : Max 2,500rpm
- DIW rinse / N2 Blow(Option :Megasonic sweep)
Control
- Process : Auto wafer loading with Automatic sequence, Wet-in/Dry-out
- Sequence control : PC & PC touch monitor, Programmable sequence, Computer Network Comparable
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Cleaning of semiconductor wafers 200㎜(8”) and 300㎜(12”)