By GNP
Supplier Info
Product Type:
Equipment
Application:
CMP, Wet Processing
Product Description:
Post CMP Wafer Cleaner is Integrated with Two Double Brush Stations with Compact Design for Small Footprint and Versatility of Cleaning (4″~12″) Wafers.
- Applicable wafer size : 100㎜(4”) and 300㎜(12”)
- Configuration : Spray cleaning, One double side brush cleaning and spin rinse dry (Option : Separated QDR)
- Cleaner size : 1,100W 1,100D 1,650H㎜
- Brush size : Ø70(OD) Ø32(ID) 170(L)㎜
- Brush gap adjustment : Automatically PLC controlled (Available brush gap range : -10㎜ ~ 2㎜)
- Chemical : NH4OH ~ 1% available
- Brush type : Double Side PVA Brush
- Brush rotating speed : Max 400rpm
- Spin speed : Manual Loading with Automatic sequence, Wet-in / Dry-outMax 2,000rpm
- DIW rinse / N2 Blow
- Process : Manual Loading with Automatic sequence, Wet-in / Dry-out
- LCD monitor touch panel, Sequence Control PLC Type
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Cleaning of semiconductor wafers : 200㎜(8”) and 300㎜(12”)