Product Type:
Equipment
Application:
CMP, Wet Processing
Product Description:
Post CMP Wafer Cleaner is Integrated with Two Double Brush Stations with Compact Design for Small Footprint and Versatility of Cleaning (4″~12″) Wafers.
Contact our team for more information on this post polishing cleaner.
- Applicable wafer size : 100㎜(4”) ~ 300㎜(12”)
- Configuration : Input spray cleaning, Two double side brush cleaning and spin rinse dry(Option : Separated QDR)
- Cleaner size : 1,610W 1,260D 1,640H㎜
- Brush size : Ø70(OD) Ø31(ID) 170(L)㎜
- Pre cleaning station : DIW spray cleaning & DIW curtain between stations
Roller brush station
- Chemical : NH4OH or DIW
- Brush type : PVA brush, Front and backside of wafer cleaned at the same time
- Brush position adjustment : Manually controlled(Available brush gap range : -10㎜ ~ 2㎜)
- Rotating speed : <±5% of full scale Range 30 ~ 200rpm
- Chemical supply : 4 Nozzle and through the brush
- Available chemical : 2 Chemical[NH4OH]
- Chemical & DI flow rate : <±5% of full scale
Spin station
- Option : Megasonic sweep
- Spin speed : Max 2,500rpm
- DI rinse / N2 Blow
Control
- Process : Post polishing cleaner has manual loading with automatic sequence, Wet-in / Dry-out
- LCD monitor touch panel, Sequence Control PLC Type
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Cleaning of semiconductor wafers 100㎜(4”) ~ 300㎜(12”)