By GNP
Supplier Info
Product Type:
Equipment
Application:
CMP, Wet Processing
Product Description:
Post CMP Wafer Cleaner is Integrated with Two Double Brush Stations with Compact Design for Small Footprint and Versatility of Cleaning (3″~6″) Wafers.
Applicable wafer size : 750㎜(3”) ~ 150㎜(6”)
Configuration:
- Stand alone with 6 cleaning station
- Wafer cassette auto loading and un-loading
- Pre-cleaning with DIW spray
- Two double side roll brush cleaning
- Spin rinse dry with N2 blow
- Cleaner size : 2,480W 1,085D 1,360H㎜
- Brush size : Ø18(ID) 310(L)㎜
- Pre cleaning station : DIW spray cleaning & DIW curtain between stations
Roller brush station
- Chemical : 2 Chemical pump(1 per brush chamber), NH4OH(< 0.1wt%) or DIW
- Brush type : Double side PVA brush
- Brush position adjustment : Manually controlled(Available brush gap range : -1.5㎜ ~ 2㎜)
- Rotating speed : <±2% of full scale Range 30 ~ 300rpm
- Chemical flo w rate : < 1L/min full scale
- DI flow rate : < 5L/min full scale
Spin station
- Spin speed : Max 2,500rpm
- DIW rinse / N2 Blow / Megasonic sweep
Control
- Process : Auto wafer loading with Automatic sequence, Wet-in/Dry-out
- Sequence control : PC & PC touch monitor, Programmable sequence, Computer Network Comparable
There are currently no downloads available.
Cleaning of semiconductro wafers 750㎜(3”) ~ 150㎜(6”)