By AXUS
Supplier Info
Product Type:
Equipment
Application:
CMP Remanufactured
Product Description:
AXUS technology is specializing in remanufacturing of CMP, Wafer Grinding & Wafer Cleaning Equipments as well as the supply of upgrades and spareparts. The Surface / IPEC 472 wafer polisher is a fully automated, precision tool for CMP polishing of semiconductor wafers used to achieve flatness, uniformity and planarization on patterned/device wafers. The Surface / IPEC 472 features automatic wafer handling and is capable of two platen, two-step polishing processing to maximize wafer throughput capability and quality. Designed to planarize wafers from 100mm to 200mm, the Surface / IPEC 472 is ideally suited for materials polishing applications that require repeatability with operational and processing flexibility. Only Axus Technology is authorized to provide ViPRR carrier upgrades for refurbished IPEC 372M and Surface / IPEC 472 CMP tools. The Surface / IPEC 472 supports a number of conditioner and carrier upgrades.
- Fully automated precision polishing
- Two platen process for post polish buff
- Multiple slurry dispense
- In-situ pad conditioner
- Material compatibility for medium and low ph slurries (1-12)
- Down force up to 750lbs.
- Controllable wafer back pressure
- Polish head clean station
- External interface for end point capability
- Temperature controlled platens
- Multizone ViPRR carrier upgrade
- SECS II Interface
Production-proven for oxide, shallow trench isolation (STI), polysilicon, tungsten, and copper planarization applications