- S3 Alliance EXM-800CS 200mm Wafer Mounter

Supplier Info

EXM-1200X Fully Automatic Wafer Tape Mounter

Wafer tape mounting for 300mm / 12 inch wafer (optionally available: 200mm / 8 inch wafer)…

Laser Cutting with heating roller and table and Digitally adjustable high pressure performance. Removes tape from…

Equipment

(De-)Taping, Mounting, Curing

Wafer Size : Up to 8 inch (To be specify wafer type prior to issue the PO)
Load Capacity : One (1 ) TTS Original Cassette Station
Unload Capacity : One (1) Unload Magazine Station
Cassette : SEMI Standard Open Cassette (Use Even slot only if use Bernoulli finger): or DSC
Frame Magazine : SEMI 25 Slots SEMI Standard 6” Frame Cassette: or SEMI 25 Slots SEMI Standard 8” Frame Cassette
Dicing Frame Type : DISCO Standard DF2-8 or Equivalent Frame Vender (To be specify wafer type prior to issue the PO)
UPH : 15 – 20 WPH (UPH depends on recipe setting)
Mounting Tape : Normal Roll shape tape (UV & non-UV tapes) or Pre-Cut Type tape(Option)
Remove Tape : Heat Seal tape Removal Function for BG Tape removal
CCD none contact alignment : CCD sensor and Bernoulli Finger type alignment for thin wafer
Long-life Roller Blade : Newly designed Roller Cutting Blade lasts up to 100,000 times. (Applicable for normal roll tape)
Heater Capability : Max 60 degree C±3 degree C @ Mount Heat Roller: Max 60 degree C±3 degree C @ Wafer stage with Soft Si Table: Room Temp (Roller Cutter)
Big LCD Touch Screen : Big color screen for user friendly and easy operations.
System Recipe capacity : 100 (Max)
Advanced Maintenance Design : Minimum-lubrication, Easy maintenance designs.

Removing Module for BG Tape : Heat Seal tape Removal Function for BG Tape removal : Maximum applicable tape width: 75 mm
Soft Si Rubber Mount Table : Applicable Soft Silicone rubber Universal Table (With Full ESD controlled contacts are) Soft Silicone rubber table achieves highly secured wafer holding during Dicing Tape Lamination
Remove Table : Applicable Ceramic Universal Table for BG Tape Remove

Ceramic Remove Table

Soft SI Mount Table

Frame Stock Station : Frame Stock station equipped with frame Stock Detection and double frames detection
Applicable Mounting Tape Width : 8” Frame > 295mm (min) 330mm (max)

Thin Wafer Capability : Micro Bernoulli Finger can be handle Thin wafer
Wafer Mapping Capability : Applicable Intellige nt Wafer Mapping at Loading Station
In Line LED UV Irradiat or : Intelligent LED UV irradiation meth ods UV Lamp Life Guaranteed 1 5,000 hours)
SECS/GEM :Applicable TTS Standard SECS/GEM capability following SEMI Stand
Frame Barco de Print & Reader : Applicable Integrated Frame barcode read er by Keyence, Printer by SATO.
Wafer ID OCR : High performance OCR Vision Engine by (Option must place PO together with equipment)

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