Product Type:
Equipment
Application:
(De-)Taping, Mounting, Curing
Product Description:
- Tape lamination for 300mm wafers (optionally available: 8 inches)
- Single and double cassette loading
- Two cutting methods (V-notch cutting): digital cutter blade method and class 4 CO2 laser method.
Laser Cutting with heating roller and table and Digitally adjustable high pressure performance. - Parameters for taping can be controlled in the recipe
- Also suitable for thinner wafers (such as shaped or reworked wafers)
- Several features are available
Machine Utilities
| Power: | AC200-240V, Single Phase |
| Power Consumption: | 3KVA |
| Clean Air Pressure (CDA): | 0.5 – 0.6 MPa (Min Flow Rate: 120NL/min) |
| Vacuum | 650 – 750mm Hg (Min Flow Rate: 60NL/min) |
| Exhaust Duct Capacity | 5.0m 3/min, 40mm H20 (100mm diameter SUS Flange duct connection) |
System Arrangement
| Dimension (WxDxH) | 1350×1750×2200mm |
| Net Weight | Appx 1000Kg |
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Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.