By TEIKOKU
Supplier Info
Product Type:
Equipment
Application:
(De-)Taping, Mounting, Curing
Product Description:
Laser Cutting with heating roller and table and digitally adjustable high pressure performance.
- Removes tape from wafers up to 200mm (4-,5-,6-, and 8-inch)
- Parameters for de-taping can be controlled in the recipe
- Longer-lasting UV lamp realized by TTS’s proprietary UV technology
- Also suitable for ultra-thin wafers
- Removing type: Sticky or Heat Seal
- Several features are available
Machine Utilities
| Power: | AC200-240V,Single Phase |
| Power Consumption: | 2KVA (without UV) / 3KVA (with UV) |
| Clean Air Pressure (CDA): | 0.5 – 0.6 MPa (Min Flow Rate: 120NL/min) |
| Vacuum | 650 – 750mm Hg (Min Flow Rate: 60NL/min) |
| Nitrogen (for UV) | 0.2 – 0.4 MPa (Min Flow Rate: 20NL/min) |
| Exhaust Duct Capacity | 1.0m3/min, 10mmH20 (100mm diameter SUS Flange duct connection) |
System Arrangement
| Dimension (WxDxH) | 1250×1400×2000mm |
| Net Weight | Appx 600Kg |
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Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.