{"id":11463,"date":"2024-04-30T17:17:21","date_gmt":"2024-04-30T15:17:21","guid":{"rendered":"https:\/\/dev.webdesign-le.de\/?p=11463"},"modified":"2024-04-30T17:17:21","modified_gmt":"2024-04-30T15:17:21","slug":"first-cmp-system-that-run-two-different-wafer-sizes-simultaneously","status":"publish","type":"post","link":"https:\/\/dev.webdesign-le.de\/de\/first-cmp-system-that-run-two-different-wafer-sizes-simultaneously\/","title":{"rendered":"First CMP system that run two different wafer sizes simultaneously"},"content":{"rendered":"

Capstone\u2122 CMP processing tool<\/h1>\n

We are delighted to introduce Capstone\u2122 – the CMP processing tool for ultimate wafer polishing performance for 100, 150, and 200mm wafer sizes from Axus Technology.<\/p>\n

\"Capstone<\/h1>\n

It is the first CMP tool that can run two different wafer sizes simultaneously.<\/strong>
\nThe integrated Crystal carrier for fragile wafer handling and advanced profile control delivers premium-quality silicon carbide substrates with sub-micron TTV and sub-Angstrom surface finish. Capstone\u00ae enhances the efficiency of chemical mechanical polishing (CMP) slurry application and utilization, resulting in a remarkable 40-50% reduction in slurry consumption<\/strong>. Additionally, its distinctive pad conditioning system extends the pad life by up to twice as much as other<\/strong> CMP tools.
\nWith Axus Capstone\u2122, we achieve material removal rates of over 10 microns per hour<\/strong> on the silicon face, ensuring outstanding product outcomes and higher throughput.<\/p>\n

The Capstone\u00ae CS200 series is the wafer processing equipment of the future and brings significant reduction in CoO, substantially reducing overall CMP process costs.<\/p>\n

Experience the future of SiC CMP technology with Axus Capstone\u2122<\/a>.<\/p>\n

 <\/p>\n

Brows all Axus products<\/a><\/p>\n

Learn more about Axus<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

Capstone\u2122 CMP processing tool We are delighted to introduce Capstone\u2122 – the CMP processing tool for ultimate wafer polishing performance for 100, 150, and 200mm wafer sizes from Axus Technology. It is the first CMP tool that can run two different wafer sizes simultaneously. The integrated Crystal carrier for fragile wafer handling and advanced profile… Read more »<\/a><\/p>\n","protected":false},"author":9,"featured_media":1300,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[1],"tags":[],"class_list":["post-11463","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"acf":[],"yoast_head":"\nFirst CMP system that run two different wafer sizes simultaneously - S3 Alliance<\/title>\n<meta name=\"description\" content=\"Capstone\u2122 CMP processing tool for wafer polishing performance for 100, 150, and 200mm wafer sizes from Axus Technology can run two different wafer sizes simultaneously.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/dev.webdesign-le.de\/de\/first-cmp-system-that-run-two-different-wafer-sizes-simultaneously\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"First CMP system that run two different wafer sizes simultaneously - 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