Product Type:
Equipment
Application:
(De-)Taping Mounting Curing
Product Description:
EXR2 Vollautomatischer 300mm Bandentferner
Wafer-Level CSP-Fertigung und spezielles MEMS-Herstellungsverfahren
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- Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.