Back Grinding Wheel

Product Enquiry

Product Enquiry Form

    opens our Privacy Policy
  • This field is for validation purposes and should be left unchanged.

By SHINHAN DIAMOND

Supplier Info


You might be interested in:

CMP Pad Conditioner

CMP Pad Conditioner A diamond tool for the planarisation of wafers. The CMP Pad Conditioner is…

Product Type:

Parts & Consumables


Application:

Grinding


Product Description:

Back Grinding Wheel

Shinhan world leading grinding wheels are based on an electroplating process, a very selective choice of diamonds (type, form, quality, size) and a highly quality controlled and repeatable manufacturing.

The Back Grinding Wheel is a diamond tool for grinding the back side of sapphire wafer, which leads to an excellent surface finish and life span.


There are currently no specification available.

There are currently no downloads available.

There are currently no videos available.

Theres currently no information available for application.



You might be interested in:

CMP Pad Conditioner

CMP Pad Conditioner A diamond tool for the planarisation of wafers. The CMP Pad Conditioner is…


Product Enquiry Form

    opens our Privacy Policy
  • This field is for validation purposes and should be left unchanged.