
Wafer Dimensional Metrology
Wafer Thickness & 3D Optical Profiler RT-3500
Hybrid metrology system measures wafer shape, sub-micro 3D structure, roughness.
INFOS3 Alliance offers a comprehensive range of advanced tools for measuring wafer thickness, resistivity, warpage, topography, and more.
Hybrid metrology system measures wafer shape, sub-micro 3D structure, roughness.
INFO