(De-)Taping, Mounting, Curing
EXM-800CS 200mm Wafer Mounter
Wafer Mount & BG Tape Remover system with in-line LED UV irradiator.
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Taping, Mounting, Curing
Discover Teikoku’s Versatile Taping, Detaping, and Mounting Solutions.
Teikoku’s innovative tools are designed to handle a wide range of substrates, including fragile and exotic materials.
(De-)Taping, Mounting, Curing
EXM-1200X Fully Automatic Wafer Tape Mounter
Inline UV irradiation and BG de-taping available, suitable for ultra-thin wafers.
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(De-)Taping, Mounting, Curing
SXR800X Semi-Automatic Tape Remover
Semi-Automatic Tape Remover. Please contact us for more information.
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(De-)Taping, Mounting, Curing
SXL800X Semi-Automatic 200mm Tape Laminator
Semi-Automatic Tape Laminator for wafers up to 200mm. Please contact us for more information.
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(De-)Taping, Mounting, Curing
EXR1200 Frame UV Irradiator
UV irradiation equipment for dicing tape, suitable for wafers up to 300mm.
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(De-)Taping, Mounting, Curing
ATM800X 200mm Wafer Mounter
For 4-, 5-, 6-, and 8-inch wafers, suitable for thinner/ bumpy wafers.
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(De-)Taping, Mounting, Curing
STM1200X Semi-Automatic Wafer Mounter
Laser Cutting with heating roller, table and digitally adjustable high pressure performance.
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(De-)Taping, Mounting, Curing
EXR2 Fully Automatic 300mm Tape Remover
Single and double cassette loading, also suitable for ultra-thin wafers.
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(De-)Taping, Mounting, Curing
EXL2 Fully Automatic 300mm Wafer Tape Laminator
Two cutting methods, e.g. patented laser cutting system, suitable for thin wafers.
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(De-)Taping, Mounting, Curing
DXR2 Fully Automatic 200mm Tape Remover
Fully Automatic 200mm Tape Remover
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(De-)Taping, Mounting, Curing
DXL2 Fully Automatic 200mm Wafer Tape Laminator
Two cutting methods, e.g. patented laser cutting system, suitable for thin wafers.
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(De-)Taping, Mounting, Curing
NDS 312/308 (6" to 12") UV Curing System
Manual 6″ to 12″ Wafer Frame UV curing Machine
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(De-)Taping, Mounting, Curing
NDS 212/208 (6" to 12") Wafer Mounting Systems
6″ bis 12″ Manuel Wafer Mounter
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