Others
DXE 5 Series Wafer Expander
Wafer Expander for a variety of film frames and hoop sets up to 152 mm (6...
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Scribing
Scribing equipment for precise cuts or markings on materials like glass, silicon, or ceramics. It is used to create precise grooves or cuts on silicon wafers, which are essential for separating individual chips during the manufacturing process. This equipment ensures high accuracy and clean breaks without damaging the delicate circuits, enabling efficient chip production.
Scribing
DTX 150 Scribe and Break
Diamond scribe and break dry dicing equipment for up to 200 mm substrates.
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